multilayer ceramic chip capacitors 1 of 3 creation date : may 08, 2017 (gmt) c1608x7r1v334m080ab tdk item description c1608x7r1v334mt**** applications commercial grade please refer to part no. cga3e1x7r1v334m080ac for automotive use. feature general general (up to 50v) series c1608 [eia 0603] status production (not recommended for new design) size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 330nf 20% rated voltage 35vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 1515m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 08, 2017 (gmt) c1608x7r1v334m080ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608x7r1v334m080ab esr c1608x7r1v334m080ab capacitance c1608x7r1v334m080ab dc bias characteristic c1608x7r1v334m080ab temperature characteristic c1608x7r1v334m080ab(no bias) c1608x7r1v334m080ab(dc bias = 17.5v ) ripple temperature rising c1608x7r1v334m080ab(100khz) c1608x7r1v334m080ab(500khz) c1608x7r1v334m080ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 08, 2017 (gmt) c1608x7r1v334m080ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
|
